SK hynix, a leading South Korean semiconductor company, is ramping up its investment in advanced chip packaging to maintain its dominance in AI development through High Bandwidth Memory (HBM). This move aims to expand and enhance the final stages of its chip manufacturing technology, with the company allocating more than $1 billion for this purpose in South Korea this year.
Lee Kang-Wook, the packaging development leader at SK hynix and former Samsung engineer, highlighted the importance of back-end technologies in the future of the semiconductor industry. Emphasizing the significance of advanced chip packaging, he stated that the last five decades have focused on the front-end, but the next fifty years will revolve around the back-end processes.
Lee’s expertise lies in the innovative combination and connection of semiconductors, which have formed the foundation of the AI industry in recent years. His journey began in 2000 when he earned his PhD in 3D integration technology for micro-systems from Japan’s Tohoku University, working under Mitsumasa Koyanagi, the inventor of stacker capacitor DRAM used in smartphones.
Lee later joined Samsung’s memory division in 2002 as a principal engineer, where he played a pivotal role in developing Through-Silicon Via (TSV)-based 3D packaging technologies. This groundbreaking work eventually laid the groundwork for HBM, a high-bandwidth memory that optimizes data processing by stacking chips on top of each other and connecting them through TSVs, resulting in faster and more energy-efficient performance.
SK hynix’s HBM modules, including the latest HBM3 and HBM3E memory modules, have become the preferred choice for NVIDIA’s AI GPUs such as Hopper H100, Hopper H200, and the upcoming Blackwell B100. As a result, SK hynix’s shares have surged by 45% in the past six months, reaching record highs. This significant growth has propelled the company to become the second most valuable enterprise in South Korea, trailing only Samsung.
CLSA Securities Korea analyst Sanjeev Rana commended SK hynix’s management for their foresight, emphasizing their preparedness to seize growth opportunities. In contrast, Rana notes that Samsung was caught off guard.
The recent announcement by SK hynix follows Samsung’s introduction of its 36GB HBM3E 12-Hi stack, in response to SK hynix’s mass production announcement of its 24GB HBM3E 8-Hi stack, as both companies compete in the HBM market.
By investing heavily in advanced chip packaging, SK hynix is cementing its position as a leader in AI development, driving innovation and propelling the semiconductor industry forward.
FAQ
1. What is SK hynix investing in?
SK hynix is investing in advanced chip packaging technology to maintain its dominance in AI development through High Bandwidth Memory (HBM).
2. How much money is SK hynix allocating for this purpose?
SK hynix is allocating more than $1 billion for advanced chip packaging in South Korea this year.
3. Why is advanced chip packaging important?
According to Lee Kang-Wook, the packaging development leader at SK hynix, advanced chip packaging is crucial for the future of the semiconductor industry. While the last five decades have focused on the front-end, the next fifty years will revolve around the back-end processes.
4. What is High Bandwidth Memory (HBM)?
High Bandwidth Memory (HBM) is a type of memory that optimizes data processing by stacking chips on top of each other and connecting them through Through-Silicon Via (TSV). It offers faster and more energy-efficient performance.
5. What are SK hynix’s HBM modules used for?
SK hynix’s HBM modules, including HBM3 and HBM3E memory modules, are used in NVIDIA’s AI GPUs such as Hopper H100, Hopper H200, and the upcoming Blackwell B100.
6. How has SK hynix’s performance been affected by its investment in advanced chip packaging?
SK hynix’s shares have surged by 45% in the past six months, reaching record highs. This growth has propelled the company to become the second most valuable enterprise in South Korea, trailing only Samsung.
7. What did CLSA Securities Korea analyst Sanjeev Rana say about SK hynix?
Sanjeev Rana commended SK hynix’s management for their foresight and preparedness to seize growth opportunities.
Definitions
– Semiconductor: A material, such as silicon, that can conduct electricity under certain conditions and is widely used in the production of electronic devices.
– Chip packaging: The process of enclosing a semiconductor chip in a protective package or casing to provide physical support and protect it from external damage.
– High Bandwidth Memory (HBM): A type of memory that enables faster data processing by stacking chips on top of each other and connecting them through Through-Silicon Via (TSV).
Suggested Related Links
– SK hynix official website
– NVIDIA official website
– Samsung official website
The source of the article is from the blog elblog.pl