Intel’s upcoming Clearwater Forest Xeon CPUs are set to revolutionize the industry with the utilization of Foveros Direct technology for 3D stacking. This innovative approach will enable the stacking of up to 288 Darkmont E-Cores on top of the base tile.
Unlike its predecessor, Sierra Forest Xeon chips, which employed P-Cores, Clearwater Forest CPUs will exclusively use E-Cores. The E-Cores found in the Sierra Forest chips were based on the modified Crestmont core architecture, while the Darkmont cores in Clearwater Forest CPUs derive from modified Skymont cores.
By fully leveraging Intel’s hybrid bonding technology, Foveros Direct, the Clearwater Forest Xeon CPUs will feature a base tile connected to the interposer through high-speed I/O, EMIB, with the cores sitting on the topmost layer.
The implementation of 3D stacking using Foveros Direct on the Clearwater Forest Xeon E-Core family is highly anticipated. These chips are expected to boast up to 288 cores and 288 threads, delivering significant improvements in IPC and efficiency. Additionally, higher cache is rumored to be incorporated into the base tile, directly connected to the cores.
Intel’s Foveros Direct technology, with its direct copper-to-copper bonding and low resistance interconnects, blurs the boundaries between the wafer and the package. This breakthrough technology, initially set to be manufacturing-ready by the second half of 2023, has undergone changes in its timeline.
Intel is scheduled to showcase more information about the Xeon Clearwater Forest CPUs during its IFS direct keynote tomorrow. The official launch is expected in 2025, marking a milestone in the evolution of CPU architecture. As competition in the industry continues to heat up, Intel’s Clearwater Forest Xeon CPUs with Foveros Direct technology are poised to make a significant impact on the market.
FAQ: Intel Clearwater Forest Xeon CPUs with Foveros Direct Technology
1. What is Clearwater Forest Xeon CPU?
The Clearwater Forest Xeon CPUs are upcoming processors developed by Intel. They are set to revolutionize the industry with the use of Foveros Direct technology for 3D stacking.
2. What is Foveros Direct technology?
Foveros Direct is Intel’s hybrid bonding technology that enables 3D stacking of components in CPUs. It allows for high-speed connectivity between the base tile and the cores, resulting in improved performance and efficiency.
3. How many Darkmont E-Cores can be stacked on top of the base tile?
Up to 288 Darkmont E-Cores can be stacked on top of the base tile in the Clearwater Forest Xeon CPUs.
4. What is the difference between Sierra Forest Xeon chips and Clearwater Forest CPUs?
Sierra Forest Xeon chips used P-Cores, while Clearwater Forest CPUs exclusively use E-Cores. The E-Cores in Clearwater Forest CPUs are based on modified Skymont cores, whereas the Sierra Forest chips used modified Crestmont core architecture.
5. What are the expected improvements in the Clearwater Forest Xeon CPUs?
The Clearwater Forest Xeon CPUs are expected to deliver significant improvements in Instructions Per Cycle (IPC) and efficiency. They are rumored to have up to 288 cores and 288 threads, with higher cache directly connected to the cores.
Key Terms:
– Clearwater Forest Xeon CPUs: Upcoming processors by Intel with Foveros Direct technology.
– Foveros Direct: Intel’s hybrid bonding technology for 3D stacking.
– Darkmont E-Cores: Cores used in Clearwater Forest CPUs, derived from modified Skymont cores.
– Base Tile: The lowermost layer in the CPU stack, connected to the interposer.
– Sierra Forest Xeon chips: Previous generation of Xeon chips using P-Cores.
– P-Cores: Core architecture used in Sierra Forest Xeon chips.
– E-Cores: Core architecture used in Clearwater Forest Xeon CPUs.
– Crestmont: Core architecture used in Sierra Forest Xeon chips.
– Skymont: Core architecture used in Clearwater Forest Xeon CPUs.
Suggested Related Links:
1. Intel Official Website
2. Central Processing Unit
3. Intel Core Processors
4. Intel Xeon Processors
The source of the article is from the blog mivalle.net.ar