Semiconductor packaging technologies have come a long way, and they continue to evolve at a rapid pace. From 1D PCB levels to the cutting-edge 3D hybrid bonding packaging, these advancements have revolutionized the industry. In a recent report by IDTechEx titled “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications,” the four critical parameters that shape advanced semiconductor packaging are identified as power, performance, area, and cost.
Power efficiency has been greatly enhanced through innovative packaging technologies, while performance has been boosted by reducing interconnection pitch for more input/output (I/O) points. As high-performance computing areas demand larger packaging areas, smaller z-form factors are required for 3D integration. Furthermore, efforts are continuously being made to reduce packaging costs by employing alternative materials or enhancing manufacturing equipment efficiency.
The report also delves into the different packaging technologies, namely 2.5D and 3D packaging. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, organic-based, and glass-based interposers. Each material type has its advantages and drawbacks in terms of cost, interconnect feature reduction, and manufacturing capabilities. Glass-based technologies, in particular, show great promise with their tunable Coefficient of Thermal Expansion (CTE) and high dimensional stability.
Microbump technology has long been established in the industry, but it faces challenges with smaller solder ball sizes and the formation of Intermetallic Compounds (IMCs), which can diminish conductivity and mechanical properties. On the other hand, hybrid bonding has emerged as a significant advancement, enabling Cu-Cu connections with pitches below 10 micrometers. This technology offers advantages such as increased bandwidth, enhanced 3D vertical stacking, and reduced parasitics and thermal resistance.
The IDTechEx report recognizes the crucial role of advanced semiconductor packaging in various markets, including AI and data centers, 5G, autonomous vehicles, and consumer electronics. It provides detailed insights into technology trends, analyzes the value chain, evaluates major players, and offers market forecasts.
With the constant evolution of advanced semiconductor packaging technologies, the future looks promising for the semiconductor industry. As innovative solutions continue to be developed, we can expect even more efficient, powerful, and cost-effective semiconductor packages that will drive progress in various fields.
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