Intel Gives Sneak Peek of Lunar Lake Chip with On-Package Memory

Summary: During Intel’s CES keynote, Michelle Johnston Holthaus provided an update on the progress of Intel’s client chips for the second half of the year. While there were no demos, Holthaus revealed a finished Lunar Lake chip, showcasing Intel’s ongoing development. The chip confirmed the inclusion of on-package memory, with two DRAM packages on one edge, a first for Intel’s Core chips. This feature is of particular interest to thin and light laptop vendors as it allows for space savings and fewer critical traces along the motherboard. Holthaus mentioned expected improvements in CPU core IPC, as well as three times the AI performance for both the GPU and NPU compared to previous models. More details on how these improvements will be achieved remain unknown. While Lunar Lake’s launch is expected later in 2024, Intel continues to focus on ramping up production for its current generation, Meteor Lake.

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