A recent tweet by Twitter user @Olrak29_ has revealed that AMD has chosen the codename “Medusa” for its upcoming Zen 6 client CPUs based on the next-generation Zen 6 architecture. This new series of chips, expected to be released in late 2025 or early 2026, will bring significant advancements to the AMD Ryzen lineup.
One notable feature of the Zen 6 client CPUs is the implementation of a brand-new interconnect based on a 2.5D chiplet design. This design allows for higher chip-to-chip bandwidth, enabling faster communication between CCDs and the IOD. The increased bandwidth is set to enhance overall performance and efficiency.
An interesting die representation showcased on Twitter indicates that the Zen 6 “Ryzen” CPUs may adopt a dual CCD chiplet design accompanied by a single IO die, similar to previous Zen generations. While the exact details are yet to be confirmed, it is speculated that the IOD may incorporate next-gen technologies, potentially resulting in improved features for the CPUs.
Contrary to stacking the CCDs on top of the IOD as seen in some previous designs, it seems that AMD has opted for a different approach with the Zen 6 Medusa CPUs to avoid the higher associated costs. It is worth noting that AMD has experimented with different stacking techniques in the past, such as the 3D V-Cache stacking on Ryzen 5000 chips, which have been further refined in the Ryzen 7000 SKUs.
With the Zen 5 lineup set to be released in 2024, it is expected that AMD will gradually start sharing more information about the Zen 6 architecture in the coming years. The Morpheus core architecture, codenamed Zen 6, is predicted to usher in a new era of performance and technological advancements for AMD.
As we eagerly await the arrival of the Zen 6 “Medusa” CPUs, it is clear that AMD’s dedication to innovation and delivering top-tier processors remains a priority. The new interconnect design and potential advancements in the Zen 6 architecture promise exciting possibilities for PC enthusiasts and professionals alike.
The source of the article is from the blog enp.gr