TDK Ventures Invests in Silicon Box to Enhance Semiconductor Chiplet Packaging

TDK Ventures, a subsidiary of TDK, has recently made an undisclosed investment in Silicon Box, a Singapore-based company focused on advanced semiconductor packaging solutions. This investment aims to boost the development of semiconductor chiplet packaging design and fabrication capabilities.

Silicon Box, founded in 2021 by industry veterans Sehat Sutardja, Weili Dai, and Byung Joon Han, specializes in the use of chiplets, smaller interconnected chips within a single package, to create a system-on-a-chip solution. This innovative approach significantly reduces the energy required for data transmission between chips, offering a scalable and cost-effective alternative to traditional monolithic chip designs.

The investment in Silicon Box comes at a crucial time as the semiconductor industry faces challenges in scalability and energy efficiency, alongside the increasing demand for machine learning, big data, and artificial intelligence. TDK Ventures recognizes the market potential for AI chips, which is expected to grow from $15 billion in 2022 to $128 billion by 2028.

TDK Ventures president Nicolas Sauvage expressed excitement about partnering with Silicon Box, highlighting their standout chiplet design and their existing 750,000 square foot facility for production support. Silicon Box CEO Byung Joon Han also expressed enthusiasm for the collaboration, emphasizing the fruitful nature of the partnership with TDK Ventures.

This investment represents a significant step towards advancing semiconductor chiplet packaging capabilities, supporting the ongoing technological advancements in the semiconductor industry.

The source of the article is from the blog mendozaextremo.com.ar

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